XT V 160

XT V 160 Electronics X-Ray Inspection

Component connections on today’s compact and densely populated PCBs are hidden by other components, making X-ray the only viable inspection solution. XT V 160 is an easy-to-use, cost-effective and high-quality PCB inspection system targeting production facilities and failure analysis laboratories.

In automated inspection mode, samples can be inspected at the highest throughput. In manual mode, intuitive software and high-precision sample manipulation enable operators to visualize and evaluate the tiniest internal defects and deficiencies.



•Patented X-ray tube technology

•NanoTechTM x-ray source with submicron focal spot

•16 bit detector technology and image processing tools

•Large tray for loading multiple boards

•60 degree viewing angle

•True concentric imaging

•Automated BGA and solder void analysis

•Intuitive software interface

•CT option

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•Solder reflow analysis

•BGA connectivity and analysis

•Solder void calculation

•Through hole measurement and inspection

•Die attach voiding measurement

•Ball bond analysis

•Stitch bond analysis

•Micro BGA / chip on chop analysis

•Pad array analysis

•Dry joint detection and analysis

•Micro-electro-mechanical systems (MEMS, MOEMS)

•Cables, harnesses, plastics and many more